This is a Memory Floorplan Analysis (MFR) of the Winbond LPDDR3 SIRIUS D2D3 die with a memory capacity of 1 Gb and a 25 nm generation node. The memory arrays with array peripheral takes about 52% of the die area. The die area occupied by memory sub-arrays is estimated to be about 38%.
OpenAI Jalapeño: The Architectural Decisions Behind Its Inference Efficiency
OpenAI Jalapeño's benchmark results have attracted attention, and a closer look at the design choices provides important context for understanding the performance. This article presents TechInsights’ commentary on the decisions disclosed at Hot Chips.
US Hyperscalers Now Drive 15 of the World’s Top 20 Datacenter Markets
Where are hyperscalers concentrating datacenter capacity? Q1 2026 data shows why 15 of the top 20 markets are in the US and which cloud providers lead.
High Bandwidth Memory in NVIDIA HGX B300: Examining the Micron HBM3E Package
Memory packaging has become a primary differentiator in AI accelerator performance. We take a look at Micron's HBM3E packaging architecture for the NVIDIA HGX B300.
