Discover the Inaugural Analysis Reports on D1β DRAM and 232L QLC 3D NAND

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Discover the Inaugural Analysis Reports on D1β DRAM and 232L QLC 3D NAND

Breaking News : The Industry’s first D1β LPDDR5X DRAM from Apple iPhone 15 Pro

Efficiently navigating the integrated 13nm DRAM cell design landscape without relying on EUV lithography, Micron's D1β DRAM process leverages high-K metal gate (HKMG) technology. This advancement has resulted in a remarkable 42% increase in memory density compared to the previous LPDDR5/5X D1α 16Gb die. The smaller die size, measuring 36.78 mm2 (7.02 mm x 5.24 mm) at the seal edge, boasts a density of 0.435 Gb/mm2.

Micron D1β 16Gb LPDDR5X Disruptive Event Report

The Current IC Market and Outlook

  • Electronic OEM sales are expected to decline by 3% and IC sales by 13% in 2023.
  • The decline in the IC market was driven by memory, which experienced overstock due to demand triggered by the COVID-19 pandemic.
  • Looking at the moving average sales for 13 consecutive weeks, NAND decreased by 22% and DRAM decreased by 30%.
  • Logic's 13-week moving average sales turned positive, while Analog and Power continued to decline. Automotive IC growth is slowing.
  • The recent AI boom shows that there is a huge demand for technologies that can accommodate AI, such as powerful GPUs and HBM.
  • Memory prices have begun to rise, a strong indicator that supply cuts are continuing across the supply chain and that a recovery is underway.
  • Memory investment is expected to decrease by 27% in 2023 and then increase by 10% in 2024, leading to a recovery.

The Semiconductor Devices in Analysis

TechInsights acquires the innovative products upon their market release and analyzes the manufacturing processes, materials, design technologies and electrical characteristics of advanced semiconductors. Find the semiconductor devices TechInsights has been analyzed and let us know if you’re interested in the analysis reports.

  • TSMC - 3nm FinFET
  • Micron - D1β DRAM, 232L NAND
  • Samsung - 3nm GAA, D1a DRAM, HBM2E
  • SK hynix & Solidigm - D1a DRAM, D1y GDDR6, 192L NAND
  • SMIC - N+2 7nm
  • YMTC - 232L NAND
  • CXMT - 22nm DRAM
  • Winbond - 25nm Pseudo-Static RAM

Device Technology Roadmaps

Device Technology Roadmaps

The technology pertaining to Logic, DRAM, 3D NAND is transforming at an accelerated pace to fulfil the needs of various application fields which will necessitate the future development of ultra-high density, high speed and low energy consumption. What technologies will be commercialized three, and five years from now?

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