Availability
Published
Product Code
MAR-2206-803
Release Date
Product Item Code
QUA-QPM6679-1V3
Device Manufacturer
Qualcomm
Device Type
Front End Module
Qualcomm QPM6679 Power Amplifier Module Architecture Analysis
The following is a report of the Qualcomm QPM6679-1V3 RF Front End Module (FEM) Architecture Analysis. The Qualcomm QPM6679-1V3 is a multi-die 5G NR n79 RF FEM that is capable of transmit and receive functions. It contains nine die including a low noise amplifier (LNA) die, two power amplifier die, a RFFE controller die, a RF switch die and four bulk acoustic wave (BAW) filter die. The Qualcomm QPM6679-1V3 RF FEM was found on the Xiaomi Mi 12 Pro (2201122C) smartphone.
 

Make informed business decisions faster and with greater confidence

Start My Free Trial

 
 

TechInsights

 
LinkedIn
X
YouTube
App Store
Google Play Store
 
 
EcoVadis
ISO 27001 Certified