This report presents a power package analysis (PKG) summary for the GaN Systems GS61008P 100 V Enhancement Mode GaN-on-Silicon HEMT five-pad bottom-side cooled GaNPX package technology. The PKG includes observed device metrics and salient features supported by the following unannotated image folders:

• Package photographs and X-ray images
• Die photographs
• Optical and SEM package cross-section photographs
• SEM-EDS spectra of selected package materials

The image set for a PKG project is derived from a package cross sectional analysis, supplemented by jet etch decapsulation, when applicable. Value added information, such as additional planes of cross-sectioning, may be included on a case-by-case basis. The PKG deliverable provides competitive benchmarking information and enables cost-effective tracking of multiple competitors' technology.