The SGC76120 die extracted from the PixelworksPX8578 display processor of the OppoFind X2 Pro multi-band handset was analyzed. It is fabricated using TSMC’s 22 nm ultra-low leakage (22ULL) CMOS process. The complete ACE deliverable includes a concise analysis summary report of critical device metrics, transmission electron microscopy (TEM) based energy dispersive X-ray spectroscopy (TEM-EDS) results, and salient features supported by the following image folders:
- Downstream product teardown
- Package X-rays, top metal and poly die photographs
- Transmission (TEM) and (SEM) bevel through the logic region and SRAM
- SEM cross section of the general device structure, metals, dielectrics, and detail of the FEOL structures