Availability
Published
Product Code
IPR-1704-801
Product Item Code
UNK-G8232_Rear-Cam
Device Manufacturer
Unknown
Device Type
Camera Module
Sony IMX400 3-Layer Stacked Image Sensor from the Xperia XZs Imager Process Review
This report presents an Imager Process Review of the Sony IMX400 19 MP, 1.22 µm pixel pitch, triple-stacked BI CIS extracted from a Sony Xperia XZs (model G8232) smartphone.
The IMX400 is Sony's fourth generation of the Exmor RS series stacked BI CIS, featuring, for the first time, a triple-stacked BI die with a DRAM die sandwiched between the ISP and CIS dies. The IMX400 uses TSVs to connect the CIS die to the DRAM and ISP dies.
The IMX400 is Sony's fourth generation of the Exmor RS series stacked BI CIS, featuring, for the first time, a triple-stacked BI die with a DRAM die sandwiched between the ISP and CIS dies. The IMX400 uses TSVs to connect the CIS die to the DRAM and ISP dies.
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