This report presents a Digital Functional Analysis of the Microsemi MSP300 die found inside the Microsemi PolarFire MPF300T component. The PolarFire MPF300T component was extracted from the Microsemi PolarFire MPF300 Future Avalanche Evaluation Kit 2.0 with the model number AVMPF300TS-02-NA.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in ICWorks Browser