This report presents a Basic Package Analysis of the Texas Instruments X66AK2E05XABD25 flip-chip ball grid array (FCBGA) package. This report contains the following detailed information: • Selected teardown photographs, package photographs, package X-rays, die markings, and die photograph • Scanning electron microscopy (SEM) and optical cross-sectional images of the package structure, die assembly, PWB package, and solder interconnect structure • Measurements of vertical and horizontal dimensions of major features • Package materials composition analysis of the main sub-components by SEM-based energy dispersive spectroscopy (SEM-EDS)