Availability
Published
Product Code
SAR-1310-902
Product Item Code
QUA-MDM9215M
Device Manufacturer
Qualcomm
Device Type
Baseband Processor
Qualcomm MDM9215M (HG11-N3877 Die Markings) 4G LTE Modem TSMC 28 nm Low Power CMOS Process Structural Analysis Report
This report presents a Structural Analysis of the 4G LTE modem die, with die markings SHELBY HG11-N3877, extracted from the Qualcomm MDM9215M multichip package (MCP). The Qualcomm MDM9215M MCP also contains an LPDDR2 SDRAM die co-packaged with the HG11-N3877 LTE modem die.
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