This report presents a MEMS process review of the InvenSense ITG-3200. The InvenSense ITG-3200 gyroscope provides a 67% package size reduction, and 50% power reduction (according to published product literature). Their patented, integrated CMOS platform has inherent cost advantages compared to competing multi-chip gyro solutions. This MEMS Process Review goes inside this latest technology from InvenSense. Available on request: an ICWorks Surveyor analysis providing software, together with a huge SEM image mosaic of the device, for navigating and measuring the architecture.