Latest Blogs and Commentary
Samsung 1a 16Gb LPDDR5X DRAM Transistor
This report presents Key DC electrical characteristics for NMOS and PMOS transistors located in the word line drivers and sense amplifiers regions of the Samsung K4L6E165YC die found inside the Samsung K3KL3L30CM-BGCT LPDDR5X SDRAM package.
SunLune Jasminer X4 Ethereum Miner ASIC Advanced CMOS Essentials
This report presents an advanced CMOS essentials (ACE) analysis of the SunLune Jasminer X4 Ethereum miner ASIC.
Micron Technology MT29F4T08EMLCHD4-RES_C 232-Layer 3D NAND Flash Memory Advanced Memory Essentials
This report presents an advanced memory essentials (AME) of the Micron Technology MT29F4T08EMLCHD4-RES_C 232-Layer 3D NAND flash memory, extracted from the Inland TD510 2 TB solid state drive.
Sony Introduces the First Line-up of LYTIA Branded CIS Products for Smartphones
Sony Introduces the First Line-up of LYTIA Branded CIS Products for Smartphones Share This Post The Smartphone industry has begun to embrace the arrival of DSLR-level capabilities in today’s smartphone cameras. The introduction of large format 1-inch
Global Smartphone Monthly Shipments (Sell In), Sales (Sell Through) and Inventory Variance by Vendor: June 2023
TechInsights tracked global smartphone shipments (sell in) and sales (sell through) went down -7% YoY and -8% YoY in May 2023 respectively.
eSIM for Massive IoT: New IoT eSIM Specification (SGP.32)
On 26th May 2023, the latest IoT eSIM specification (SGP.32) was released by GSM Association.
2023 ADAS ECU Market Share Estimates
This Excel file contains ECU market share estimates for key ADAS technologies - a market expected by TechInsights to be worth over $15.5 billion in 2023.
Global Wearables Microvendor Market Share: Q1 2023
A huge number of second-tier MICROVENDORS are playing a meaningful role in the global wearables market, flooding the market with new, niche, and segmented offerings.
Visibility remains low as we enter 2H23 (June Update)
Visibility remains low as we enter 2H23 (June Update) Shereen Vaux Order activity for semiconductor equipment increased but remains at a cold 42 °F. There were some notable changes made to our forecasts this month. ICs were upgraded; sales are now
TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics Report
Apple M2 Max APL1111 SoC Processor TSMC N5P FinFET HKMG CMOS Process Digital Floorplan Analysis
This report provides an analysis of the floorplan design used in the Apple M2 Max APL1111 SoC Processor, fabricated using TSMC N5P FinFET HKMG CMOS process.
Global Military Land Radio Market and Technology Forecast 2021- 2031
End Market Analysis forecasts global land military radio expenditure will approach $7.2 billion in 2031, representing a CAGR of 3.2%.
Global Military Airborne Radio Market and Technology Forecast 2021- 2031
End Market Analysis forecasts global military airborne radio expenditure will approach $2.6 billion by 2031, representing a CAGR of 3.2%.
Global Military Airborne VSAT Market and Technology Forecast 2021-2031
End Market Analysis forecasts the global airborne military VSAT expenditure will approach $1.9 billion by 2031, representing a CAGR of 3.8%.
Global Military Communications Market 2021-2031
End Market Analysis forecasts that global military communications expenditure will approach $46.9 billion in 2031 from $31.2 billion in 2021, representing a CAGR of 4.2%.
Germany Handset Vendor Marketshare by Operator: Q1 2023
We estimate 6.0 million handsets were shipped in Germany in Q1 2023, declining by -12% YoY during the quarter.
Taiyo Yuden FSDCSQ8T782MK2J6 Surface Acoustic Wave (SAW) Filter Process Analysis
This report presents a process analysis (AFS) of the Taiyo Yuden FSDCSQ8T782MK2J6 Surface Acoustic Wave (SAW) Filter, extracted from the Honor 70 5G smartphone.
ams OSRAM ISP Die from Mira220, 2.2 MP Resolution, 2.79 μm Pixel Pitch Stacked Back-Illuminated NIR Enhanced Voltage Domain Global Shutter CMOS Image Sensor Standard Floorplan Analysis
This report presents a standard floorplan analysis (FAR) of the ams OSRAM ISP Die from Mira220, 2.2 MP Resolution, 2.79 μm Pixel Pitch Stacked Back-Illuminated NIR Enhanced Voltage Domain Global Shutter CMOS Image Sensor.