Sustainability Outlook for 2027
Emissions, Nodes & Memory
As output grows, so does the industry's carbon footprint. This session breaks down where 2027 emissions will come from and what that means for manufacturing and supply chain decisions.
MT CO₂e from semiconductor manufacturing in 2027, a record
Logic's share, driven by advanced-node AI and HPC
Legacy nodes' share of total emissions
What you'll learn
Where 2027 emissions come from
Each topic draws on the 2027 Outlook reports. Bring your questions for the audience Q&A.
The 2027 forecast: a record 197 million MT CO₂e
Semiconductor manufacturing carbon emissions are projected to reach 197 million MT CO₂e in 2027, a new record high as the industry itself expands rapidly.
Why 3D NAND carries an outsized share of memory emissions
Memory will account for over a third of all CO₂e in 2027. Despite DRAM shipping in higher volumes, 3D NAND drives disproportionate emissions, and the ramp of >300-layer 3D NAND across Asian fabs is a primary driver.
Scope 2 electricity use at 2nm and 3nm
Logic will account for 46% of emissions. Each successive technology node escalates off-site electricity consumption, so 2nm and 3nm scaling is reshaping the industry's environmental footprint.
Legacy nodes: lower intensity per unit, over 40% of total emissions
Legacy nodes (>26 nm) are less carbon-intensive per unit than advanced nodes, but will account for over 40% of total emissions because of the high volume of devices produced.
Reports included
