Intel Panther Lake 18A (16th Gen Ultra X7 358H) Process Analysis

Analysis details the Intel 16th Gen Ultra X7 358H Panther Lake compute die, examining 18A RibbonFET FEOL, MOL, and BEOL structures.

This report provides an analysis of the structure and materials used in the manufacture of the Intel 16th Gen Ultra X7 358H (Panther Lake) CPU die (compute chiplet), fabricated using the Intel 18A Gate-All-Around (GAA) process marketed by Intel as RibbonFET. The report includes a summary of key findings and a detailed look at the FEOL, MOL, and BEOL structures and materials used. Extensive SEM, TEM, and materials analysis provide a complete look at how this device was manufactured.