Analysis: Utilization in High-Value Nodes Spikes

 

  2 Min Read     February 2, 2026

 
 

TSMC’s 3nm capacity squeeze forces customers to weigh Samsung and Intel alternatives, with orders booked through 2027 and performance data in focus.

Analysis: Utilization in High-Value Nodes Spikes

TSMC’s advanced 3 nm capacity remains extremely tight, forcing some major customers to consider shifting orders to Samsung and Intel’s advanced nodes, as capacity is fully booked through 2026–2027. This report accompanies the Industry Performance Data Table.

 

This summary outlines the analysis* found on the TechInsights' Platform.

*Some analyses may only be available with a paid subscription.

 

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