This report presents a Process Node Assessment of the Broadcom 4FR9A RF antenna tuner die found inside the Broadcom AFEM-8072 package. The AFEM-8072 was extracted from the main printed circuit board (PCB) of the Apple iPhone 8.
This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Transmission electron microscopy (TEM) cross-sectional micrographs of the transistors and the gate oxide
• TEM-based energy dispersive spectroscopy (TEM-EDS) analysis of the dielectrics, metals, and transistors