This report presents a Basic Functional Analysis of the Silead 6162 die found inside the Silead GSL6162 package, which is a capacitive fingerprint sensor component. The GSL6162 component comprises a silicon die, which is mounted on a printed wiring board (PWB). Bonding wires interconnect the die to the PWB. The 6162 die was manufactured using five layers of Al metal, tungsten (W) contacts, shallow trench isolation (STI), and a single layer of polysilicon to form the transistor gates.