Latest Blogs and Commentary
5 Expectations for the Mobile Market in 2026
Join TechInsights on Jan 5/6, 2026, for a free webinar on the top 5 mobile semiconductor market expectations. Explore AI adoption, hardware innovation, tariffs, BRIC market growth, and form-factor shifts.
5 Expectations for the Manufacturing Market in 2026
Join TechInsights on Jan 14/15, 2026, for a free webinar exploring five key trends in semiconductor manufacturing, including AI-driven capacity, sustainability, glass substrates, and equipment growth.
Summary - BIWIN Mini SSD 1 TB Deep Dive Teardown
Discover the BIWIN Mini SSD, an ultra-compact PCIe 4.0 x2 NVMe device analyzed in our Deep Dive teardown with detailed construction, benchmarking, and cost insights.
5 Expectations for the Consumer Electronics Market in 2026
Join TechInsights on Dec 16/17, 2025, for a free webinar exploring five key trends in consumer electronics for 2026, including AI adoption, tariffs, smart home, displays, and smart glasses.
5 Expectations for the PC/Laptop/Tablet Market in 2026
Join TechInsights on Dec 9/10, 2025, for a free webinar exploring five key trends in PCs, laptops, and tablets for 2026, including on-device AI, tariffs, mid-market opportunities, and processor innovations.
Cost Explorer: Optimizing PPACtE for Semiconductor R&D
TechInsights’ Cost Explorer adds cost, cycle time, and carbon modeling to Synopsys DTCO workflows, enabling full PPACtE optimization before costly test wafers.
Sony Launches First 200MP Smartphone Sensor: LYTIA 901
Sony debuts its first 200MP smartphone sensor, the LYTIA 901, featuring a 1/1.12-inch format, 0.7µm pixels, AI remosaicing, advanced HDR, and flagship zoom performance.
Global Handset vendor share Q3 2025
Global handset shipments were nearly flat in Q3 2025, with six top vendors showing annual growth. The report includes market share data for 30 vendors by region.
Honor’s Q3 2025 Growth Fueled by Mid-Tier Sales
Honor experienced double-digit YoY smartphone shipment growth in Q3 2025 due to overseas expansion, but faced declining wholesale ASP and revenue challenges.
Advanced Packaging - Smartphone Processors
Smartphone APUs integrate CPU, GPU, and modems, with innovations in packaging like PoP and fan-out addressing heat, space, and durability challenges.
Industry Performance (TCI Graphics) – November 21, 2025
Discover how surging prices and low supplies impact AI infrastructure demand. Access weekly, monthly, and yearly data to enhance supply chain management.
5 Expectations for the Advanced Packaging Market in 2026
Explore five key trends in advanced packaging for 2026, including co-packaged optics, HBM, 3D stacking, and mobile chiplets. Watch on-demand anytime.
2025 Q4 Advanced Driver Assistance Systems 2023-2032
The ADAS market is shifting from dedicated systems to centralized platforms, presenting new challenges and opportunities for suppliers.
Company Earnings – Q3 2025 (Q3 FY 2026) NVIDIA
Explore key insights from Nvidia's quarterly earnings call, covering revenue, profit, inventory, and market commentary on demand and supply trends.
Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
OECD Fixed Broadband Price Benchmarking Q3 2025
Explore the Q3 2025 OECD Fixed Broadband Price Benchmarking update, featuring 1,500+ tariff plans from 120 providers across 38 countries.
The 2026 Roadmap Begins Here
Get a data-driven view of the technologies, markets, and supply-chain dynamics that will define 2026 and beyond.
AMD Ryzen 9 7950X3D Advanced Packaging Process Flow Analysis
Dive into TSMC’s SoIC 3D integration with our analysis of the hybrid-bonded SoIC-X process in AMD’s 7950X3D, outlining key packaging steps and critical dimensions.