Product Code
SAR-0304-007
Availability
Published
Product Item Code
SON-CXP103049
Device Manufacturer
Sony
Device Type
ASIC
Sony CXP103049 ASIC Structural Analysis Report
This report presents a Structural Analysis of the Sony CXP103049 ASIC device. The device was manufactured in a CMOS process with five levels of metal (tungsten metal 1) and one level of polycide (tungsten silicide). The process uses local oxide isolation (LOCOS) and twin wells in a P-epi on a P-substrate.
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