HiSilicon has the most design wins for the Huawei Y9s 2019 edition smartphone, supplying nine major ICs, which include the octa-core HiSilicon Kirin 710F application/baseband processor, three power management chips (one with embedded audio codec), the RF transceiver, the WiFi/Bluetooth/GPS module, two RF power amplifier moduless, and one front-end module.