This report presents a Structural Analysis of the microprocessor silicon die from the Intel SR217 Broadwell Core M-5Y10 package, fabricated using Intel’s 14 nm tri-gate logic process (dubbed P1272). The Broadwell SR217 Core M-5Y10, extracted from the Panasonic CF-RZ4 10.1" notebook personal computer, is a fanless microprocessor package that dissipates less than 5 W of power. The SR217 flip-chip ball grid array (FCBGA) package with 1,234 balls features two dies: a 0.8 GHz dual-core Broadwell processor die and a low power platform controller hub (PCH-LP) bumped to the top of a printed wiring board (PWB). To achieve power and space efficiency, 3D inductors (3DLs) have been placed on the underside of the package.