This report contains the following detailed information:

• Summary of observed device metrics and salient features
• Package optical photographs, package X-ray images, die photographs, optical photos of the die feature image set
• Plan-view images of the device delayered to the gate level
• Exploratory cross-sectional scanning electron microscope (SEM) images of the device structure
• Detailed cross-sectional transmission electron microscope (TEM) images of the device structure
• Epitaxial layer composition identification based on TEM-based energy dispersive spectroscopy (TEM-EDS) results

The image set for a standard PEG project is derived from a delayered sample for SEM planar analysis, a single plane of cross-sectioning for SEM structural analysis and cross-sectional TEM analysis. Value add information, such as additional planes of cross-sectioning, may be included on a case-by-case basis.
The Power Essentials deliverable provides basic competitive benchmarking information and enables cost-effective tracking of multiple competitors’ technology.