Availability
Published
Product Code
MFR-2209-803
Product Item Code
NXP-200VB111_die
Device Manufacturer
NXP Semiconductors
NXP SN200 GlobalFoundries 40 nm eFlash Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the embedded flash (eFlash) on the NXP Semiconductors SN200 die found inside the NXP 200VB111 component. The 200VB111 packagewas extracted from the Apple A211 iPhone 11 smartphone downstream product.
The Authoritative Information Platform to the Semiconductor Industry.
