The following is a Module Architecture Analysis report of the Qualcomm QPM6670-000 MHB L-PAMiD. It is a Mid-Band, High-Band (MHB) Radio Frequency Power Amplifier Module with LNA and integrated duplexers (L-PAMiD) developed for 4G LTE and 5GNR applications. The QPM6670-000 can be found in multiple handsets as outlined in the device genealogy. The specific component used in this analysis was taken from the Sony Xperia 1 V (XQ-DQ54) mobile handset from the United States.