The report details the architecture of the Avago AFEM-8234 MHB L-PAMiD which was found in the Apple iPhone 15 Pro Max Smartphone. This module contains a Power Amplifier (PA) die, a Low Noise Amplifier (LNA), three RF Switch die plus 17 Film Bulk Acoustic Resonator (FBAR) die. This multi-die module is packaged in a 175-pin BGA (Ball Grid Array) package that measures 5.88 mm x 5.75 mm and is formed with 9-layer PWB (Printed Wiring Board) with the die mounted on both sides of the PWB.