The following is a report of the Qualcomm QPM7815 Mid/High-Band (MHB) L-PAMiD Module Architecture Analysis. The Qualcomm QPM7815 is a multi-die MHB L-PAMiD that is capable of transmit and receive functions. It contains twelve die including two power amplifier die, a low noise amplifier (LNA) die, a RFFE controller die, two RF switch die and six Surface Acoustic Wave (SAW) filter die. The Qualcomm QPM7815 MHB L-PAMiD was found on the Samsung Galaxy S23 Ultra 5G (S918U) smartphone.