Qualcomm QBT1000 Snapdragon Sense ID Controller Basic Functional Analysis

Product Code
FAR-1605-803
Release Date
30/06/2016
Availability
Published
Product Item Code
QUA-QBT1000
Device Manufacturer
Qualcomm
Device Type
Other
Report Code
FAR-1605-803
This report presents a Basic Functional Analysis of the Qualcomm HG11-NJ670-400 die found inside the Qualcomm QBT1000 package.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to polysilicon
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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