This report presents a Basic Functional Analysis of the MediaTek AM10279B die found inside MediaTek’s MT6797W component. The MediaTek MT6797W is also known as Helio X25. The MediaTek Helio X25 is a mobile processor with
Tri-Cluster™ CPU architecture and 10 processing cores (deca-core). It delivers extreme computing performance and power efficiency.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to polysilicon
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process