This Basic Functional Analysis analyses the Spreadtrum SC8810T application processor. Chipworks Functional Analysis Reports focus on a device's floor plan and block level functionality, to give you an architectural understanding of the die. This knowledge, in conjunction with basic process information, can then be used as a benchmarking tool to perform a high level cost analysis. This report contains the following detailed information: package photographs, package X-rays, die markings, and die photographs with annotated functional blocks and memories, identification of major functional blocks on the polysilicon die photograph, table of functional block sizes and percentage of die utilization, high resolution top metal and polysilicon die photographs delivered in ICWorks Surveyor, measurement of vertical and horizontal dimensions of major microstructural features, SEM cross-sectional micrographs of metallization and transistors, and manufacturing cost analysis.