This report is a Basic Functional Analysis of the main die from the Qualcomm MSM7225A system-on-chip (SoC) mobile application processor with digital signal processor (DSP). Chipworks Functional Analysis reports focus on a device's floor plan and block level functionality, to give you an architectural understanding of the die. This knowledge, in conjunction with basic process information, can then be used as a benchmarking tool to perform a high level cost analysis.