Chipworks' Functional Analysis reports focus on a device's floor plan and block level functionality, to give you an architectural understanding of the die. This knowledge, in conjunction with basic process information, can then be used as a benchmarking tool to perform a high level cost analysis. The MStar MSD808KCVF S8+ 3D DTV SoC Functional Analysis Report includes the following detailed information: package photographs, package X-rays, die photographs, and a die photograph with annotated functional blocks and memories, measurements of vertical and horizontal dimensions of major microstructural features, scanning electron microscopy (SEM) cross-sectional micrographs of dielectric materials, major features, and transistors, plan-view optical micrographs of the substrate delayered to poly, and identification of major functional blocks.