The Basic Functional Analysis Report covers process analysis (device cross-section, minimum features, critical dimensions, and node determination), die size, top metal and delayered M1 or poly die photos, die floorplan annotation, and block size measurements. It includes a table summarizing the L, W, Area, and the % die area of each block. Major layout blocks are annotated and identified using literature research, location on die, and layout features.

Contents Include:

- Device Summary
- Observed Critical Dimensions
- Device Identification
- Die Overview
- Process Analysis
- Functional Layout Analysis
- Functional Block Measurements