Availability
In Creation
Product Code
DFR-2312-801
Product Item Code
QUA-HG11-35514-1
Device Manufacturer
Qualcomm
Qualcomm Snapdragon XR2 Gen 2 (AI Integration) Digital Floorplan Analysis
This report provides an analysis of the floorplan design used in the MediaTek Dimensity 9300 manufactured in TSMC's 4NP technology and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets. The report provides process node and foundry identification, critical dimensions, functional and digital block summaries and gate count, memory block analysis
The Authoritative Information Platform to the Semiconductor Industry.
