Qualcomm QTM525 (HG11-PG660-200) mmWave Antenna RF Transceiver Floorplan Analysis

Product Code
BFR-2004-810
Release Date
29/06/2020
Availability
Published
Product Item Code
QUA-QTM525-501-BA
Device Manufacturer
Qualcomm
Device Type
RF Antenna Module
Report Code
BFR-2004-810
This report presents a Basic Floorplan Analysis of the Qualcomm HG11-PG660-200 die found inside the Qualcomm QTM525 mmWave antenna module. The QTM525 module was extracted from the Samsung Galaxy S20+ 5G smartphone.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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