Product Code
AME-2001-802
Release Date
Availability
Published
Product Item Code
IBM-02CY297
Device Manufacturer
IBM
Device Type
Microprocessor
IBM Power9 (14HP FinFET SOI eDRAM) Advanced Memory Essentials
The Advanced Memory Essentials (AME) deliverable comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic memory array and peripheral regions
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • A single TEM cross section through the MRAM cell and orthogonal to wordlines, showing the MRAM cell, metals and dielectrics, cell transistor gate stack, isolation, and other FEOL features
The results of TEM-EDS analyses are included in the AME summary document. The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.
 

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