The Micron Technology B57T die is found inside Micron Technology MT29F2T08ELLLHL4-QA_L package. There is one Micron Technology MT29F2T08ELLLHL4-QA_L package in the Micron Technology MTFDKBA256TGE-1BL1AABYY 256 GB 22 × 80 mm M.2 form factor solid-state drive (SSD).

Infineon and NXP continued to lead the automotive semiconductor supplier rankings in 2023, based on TechInsights annual assessment of automotive semiconductor vendor share, which presents analysis of 2023 automotive sector revenues and market shares of the leading semiconductor vendors, with revenue splits by major component product category and by region.

This database provides a panoramic view of key players in the charging infrastructure business worldwide, including charging point manufacturers, charging point operators, and service providers.

Qorvo, which produces gallium nitride (GaN) based radio products for millimeter wave applications, announced it would acquire CMOS millimeter wave radio chip vendor Anokiwave. This raises the question: Does Qorvo plan to abandon GaN in favor of CMOS?

In March 2023, Tesla CEO Elon Musk said that the electric vehicle maker will use 75% less silicon carbide (SiC) without compromising the performance or efficiency of its models. TechInsights’ Stephen Russell gave predictions on how chip designs could enable this. But at the 2024 Automotive Tech Forum, vendors such as Infineon and STMicroelectronics, presented the answer: The hybrid power electronics module that uses both silicon and SiC devices.

As the memory capacity of NAND packages increases with increased stacking of dies, issues such as large capacitive loading, input/output (I/O) speed reduction, and increased power consumption limit the packages from achieving the desired I/O speed, even when paired with a suitable SSD controller. This featured content report explores some recent NAND to SSD controller techniques.

TechInsights' report on cockpit innovations examines developments of in-car infotainment in audio streaming, video, and gaming, examining announced OEM partnerships, data and content service providers, and trends in displays.

Dive deep into the absence of high-density interconnect pads in the M3 Max and its implications for the highly anticipated Apple M3 Ultra.

Final calendar year 2023 ranking of the top 25 semiconductor suppliers are presented. No new suppliers broke into the top 25 list in 2023, but there were significant changes in where companies were ranked.

This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro 3 nm GPU, fabricated using FINFLEX methodology by TSMC. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.