KIOXIA FXZ5_512G 162L 512 Gb TLC 3D NAND Transistor Characterization

The Toshiba TH58LKT2V46BA8S TLC 3D NAND flash is a 154-ball grid array (BGA), multi-chip package (MCP), measuring 13.5 mm × 11.5 mm × 0.9 mm thick, including solder balls. The TH58LKT2V46BA8S contains eight stacked KIOXIA 162-layer FXZ5 512G dies, arranged in two side by side four die stacks. Bond wires connect the two die stacks to the two wider sides of the printed wiring board (PWB).
11Apr

Unlocking Tomorrow's Semiconductor Secrets

Unlock the secrets of tomorrow's semiconductor industry with our exclusive fireside eBook featuring G. Dan Hutcheson. Gain invaluable insights into emerging trends, global dynamics, and the transformative impact of technologies like AI.
10Apr

Trackers: TV & Video Services

These quarterly reports provide subscriber, revenue, and market share data for subscription video-on-demand (SVOD) services, pay TV operators, online advertisers, video services, gaming services, and music services by vendor.
09Apr

India: Automotive Infotainment and Connected Services 2024 Update

Automakers are consistently incorporating additional connectivity, safety, security, and entertainment features to gain a competitive edge and sell more cars. In the pursuit of expanding their market share, connectivity is anticipated to play a role, as more models currently available in the market are equipped with embedded cellular connectivity, particularly top-end models.
09Apr