Lightmatter’s Passage substrate is an active photonic interposer for interconnecting chiplets. All the photonic components and supporting electrical circuits reside in a single multi-reticle piece of silicon.

To tackle the largest AI models, Nvidia has designed a processor to feed its powerful new Hopper GPU. Grace has twice the memory bandwidth of any x86 processor and can hold GPT-3 in DRAM.

Govt Tech Controls & Chip Slowdown G. Dan Hutcheson The Chip Insider® The Greater Geopolitical Messaging of U.S Government Technology Controls: A few weeks ago the U.S. Government put Export Controls on EDA and Wide Bandgap Substrates. Then they blocked Nvidia & AMD from selling advanced AI chips in

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

Packaging has become more sophisticated and a differentiator in the overall performance of advanced SoC chipsets. It can significantly impact form factor, helping to miniaturize designs in the multichip package and improve chip-chip RC delay. The Ultra is the first example of a device utilizing InFO-L technology that TechInsights has documented.

Semiconductor sales dipped 6% below 2021 levels last week, as the IC weather cooled 1˚F to Chilly conditions. Zooming in on DRAMs this week, the 13-wk growth MA dropped to -13% Y/Y, falling off last year’s peak of +54% in October.

In this eBook, TechInsights brings you our first analyses of two innovative SiC FETs whose electrical characteristics are assessed with results presented under identical condition. Using a comprehensive array of test conditions and add extra valuable information, we delve into their robustness under stress and go well beyond the datasheet.

This on-demand podcast brings together Bloomberg Senior Hardware Analyst Woo Jin Ho and TechInsights’ Forecasting Analyst, Taylor St. Germain for an in-depth discussion about the state of the semiconductor supply chain.

TechInsights has just received the Motorola Moto X30 Pro (XT2241-1) smartphone and launched an analysis on its wide-angle rear camera, confirming the Samsung HP1.

Temperatures are cooling amid rising uncertainty Andrea Lati Order activity for semiconductor equipment slipped to 82 degrees The weakness in Memory and Subcon/Adv. Packaging continued to weigh on the overall activity The memory market is now in the midst of a downturn due to a significant supply