Processor Market & Research Analysis
Our unique combination of deep semiconductor industry contacts, data analytics, with databases and information libraries that reach back seven decades, combined with our locations in the world's technology hot-spots make us perfectly suited for the development of the world's most distinguished semiconductor market research.
Our core coverage is of processors and SoCs for servers, PCs, supercomputers (HPC), smartphones, wearables, embedded systems, IoT devices, communications and networking equipment, and advanced automotive applications. We also cover licensable and open-source cores for CPU, DSP, graphics, and other functions. Many of our recent articles cover AI accelerators for cloud, edge, automotive, mobile, and IoT.
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Microprocessor Report
This industry-leading weekly journal covers new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.
AI Processor Service
This annual subscription is updated quarterly and covers hardware technologies and products from more than 55 companies. The 300+ page report provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs, and why. TechInsights’ unique technology analysis provides a forward-looking view, helping sort through competing claims and products.
Communications Market Service
This subscription provides the detailed market information needed to sort out the complexities of the communications semiconductor market. With this analysis, chip vendors, investors, and OEMs will readily see how big the mature product markets are and how fast the emerging categories are growing.
Our experts possess the unique combination of technical expertise and specific market knowledge to help you successfully navigate the complexities of these markets. With broad backgrounds in product design, marketing, management, and industry analysis, we deliver informed, real-world perspectives to your issues.
We deliver the crucial information necessary to make intelligent business decisions.
We deliver the crucial information necessary to make intelligent business decisions.
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Whitepapers
Whitepaper - Democratizing Chiplet-Based Processor Design
Chiplet-based designs promise reduced development costs and faster time to market, but they’ve been exclusive to large chip vendors. Now, the industry is building an ecosystem intended to enable designs combining third-party chiplets that employ different process nodes. At the same time, RISC-V is enabling greater CPU innovation through its open-source model. These trends create an opportunity for a RISC-V chiplet vendor. Ventana Micro Systems sponsored the creation of this white paper, but the opinions and analysis are those of the author.
Whitepaper - Bit-Accurate CD Audio From apX Lossless
Thanks to the development of Bluetooth audio technology, wireless streaming has largely replaced physical media, and smartphone users no longer need to struggle with tangled earphone wires. But to accommodate Bluetooth’s limited bandwidth, the industry adopted a variety of lossy compression techniques that sacrifice audio fidelity. This white paper describes the benefits of the aptX Lossless codec, which enables wireless Bluetooth earbuds and speakers to stream audio that’s bit accurate to the original CD recording. The Linley Group prepared this paper, which Qualcomm sponsored, but the opinions and analysis are those of the author.
Whitepaper - Software is Critical to Edge-AI Deployment
This white paper describes the importance of a flexible and robust software stack to edge-AI deployment. Processor vendors and intellectual-property licensers often tout the theoretical performance of their designs, but the neural-network compiler, run-time engine, and scheduler are just as critical to realizing that potential in production systems. The Linley Group prepared this paper, which EdgeCortix sponsored, but the opinions and analysis are those of the author.Latest Posts From Our Blogs
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TSMC, Apple, and Samsung have all leveraged different Fan-Out Packaging. Join us to get an update on the latest progress of Wafer Level and Panel Level Fan-Out Packaging.
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A Trip Down TSMC Memory Lane – Part 1
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Webinar: Hybrid bonding technology - today and tomorrow
TechInsights experts review applications of hybrid bonding technology, and discuss what’s to come. This presentation compiles content from TechInsights’ subject matter experts in Memory, Image Sensor, and Logic, and from Engineers specializing in a variety of reverse engineering techniques.
YMTC’s Xtacking 3.0 – Not what TechInsights was expecting to see
Memory Blog YMTC’s Xtacking 3.0 – Not what TechInsights was expecting to see Contributing author: Chi Lim Tan Yangtze Memory Technology Company (YMTC) has been making headlines since it was founded in 2016. Considered China’s leading Integrated