Microprocessor Report
For more than 30 years, Microprocessor Report (MPR) has been the industry's go-to source for the latest microprocessor news. This subscriber-only publication covers a broad range of semiconductor topics. We publish an average of three new articles per week, each covering a new product, technology, or trend.
Our core coverage is of processors and SoCs for servers, PCs, supercomputers (HPC), smartphones, wearables, embedded systems, IoT devices, communications and networking equipment, and advanced automotive applications. We also cover licensable and open-source cores for CPU, DSP, graphics, and other functions. Many of our recent articles cover AI accelerators for cloud, edge, automotive, mobile, and IoT.
Deep Insight and In-Depth Analysis
Today's complex SoCs contain a variety of functions beyond the processor, so our coverage extends to wired and wireless communications protocols such as 5G, LTE, Ethernet, Wi-Fi, PON, PCI Express, and InfiniBand. We also cover special-purpose chips such as search engines, fabrics, silicon photonics, FPGAs, PHYs, cellular RF, high-bandwidth memory, and new memories such as Optane and NRAM.
We often write about new companies, new technologies, and new design approaches to keep our subscribers up to date on trends. We are particularly interested in new technologies for SoC design and manufacturing. We also keep an eye on mergers and acquisitions, and we use our in-house market-share data to highlight shifts in the market.
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Microprocessor Report
NXP Offers Watermarks for AI Models
Trained machine-learning models can be valuable, and techniques have been developed to identify them in case of theft. NXP has introduced a tool that implements a straightforward approach to watermarking image-classification neural networks.
ST Tightens MCU Security
The STM32H5 family updates STMicroelectronics’ high-performance-MCU line with additional security. Installing the new Secure Manager software on the flagship model can yield a complete security suite with no required coding.
Marvell Adds Fusion Models to Octeon 10
Octeon 10 Fusion combines Arm Neoverse N2 CPUs, packet-processing hardware, DSPs, and in-line wireless accelerators. Targeting 5G infrastructure, it’s the only merchant-market integrated base-station processor for macrocells.
Chiplet Technology Advances
Packaging technology goes hand in hand with chiplets. Examples include basic PCB-based 2D structures, passive silicon interposers and bridges for 2.5D packages, 3D packages employing active interposers, and hybrid bonding.
Generative AI on a Phone?
Generative-AI models such as ChatGPT are typically large and run only in the cloud, but Qualcomm recently demonstrated a smaller image-generation model called Stable Diffusion performing inference on a smartphone.