2027 Outlook for Semiconductor Advanced Packaging and Manufacturing
Packaging, Process & Capacity
Packaging and lithography will set the ceiling on 2027 output. See where capacity is tightening, which companies stand to gain, and why yield and qualification matter as much as new fab announcements.
Annual growth in TSMC CoWoS and SoIC capacity, still short of demand
EUV systems ASML delivers a year, capping advanced-node ramps
For a leading-edge memory fab to come online
What you'll learn
Where 2027 capacity runs out
Each topic draws on the 2027 Outlook reports. Bring your questions for the audience Q&A.
CoWoS and SoIC capacity against logic and HBM demand
TSMC's advanced packaging capacity will remain the bottleneck. CoWoS and SoIC capacity is projected to grow 20–25% annually, against rising demand from logic and from HBM, which also requires advanced packaging.
HBM4, hybrid bonding, and chiplet architectures
Chiplet-based architectures with hybrid bonding, notably from AMD and Intel, will dominate highperformance computing by 2027. HBM4 introduces wider interfaces, taller stacks, custom logic dies and closer integration with accelerators.
EUV tool supply and the widening gap in advanced logic
ASML's EUV tool delivery rate, around 30–40 systems a year, limits how many fabs can ramp advanced nodes at once. Fabs with secured EUV tool allocations will have decisive capacity advantages.
China's growing role in DRAM and NAND supply
China will help ease conventional DRAM and NAND supply, particularly for domestic and pricesensitive applications, but not the HBM wafer capacity AI needs most. CXMT's IPO and YMTC's NAND wafer bonding strengthen both companies' positions.
Reports included
