The ISP die from the Samsung S5KGM5SX, a rear periscope-telephoto camera module that was extracted from the Google Pixel 7 Pro smartphone. The camera module measures 29.6 mm × 14.4 mm × 6.8 mm thick. It contains a stacked imager comprising a CIS die and an ISP die.
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OpenAI Jalapeño's benchmark results have attracted attention, and a closer look at the design choices provides important context for understanding the performance. This article presents TechInsights’ commentary on the decisions disclosed at Hot Chips.
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High Bandwidth Memory in NVIDIA HGX B300: Examining the Micron HBM3E Package
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