This report presents a Basic Floorplan Analysis of the HiSilicon Hi1152V100 Wi-Fi 6 SoC die found inside the HiSilicon Hi1152 component, which was extracted from the Huawei AX3 wireless router. It supports up to 3 Gbps peak throughput, at a peak frequency bandwidth of 160 MHz with two antennas and is torn down from the Huawei Wi-Fi AX3 Wi-Fi 6 router WS7100.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process