NXP Semiconductors NXH3670UK_A1Z RF Microcontroller Basic Floorplan Analysis

Product Code
BFR-1903-801
Release Date
25/04/2019
Availability
Published
Product Item Code
NXP-NXH3670UK/A1Z
Device Manufacturer
NXP Semiconductors
Device Type
Microcontrollers
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Functional Analysis
Report Code
BFR-1903-801
This report presents a Basic Floorplan Analysis of the NXP Semiconductors NXH2003UKC1 die found inside the NXP NXH3670UK_A1Z component.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon level
  • Identification of major functional blocks on gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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