This report presents a Basic Functional Analysis of the sPN549V0A die found inside the NXP 66V10 NFC component. The 66V10 was extracted from the Apple iPhone 6s smartphone. The 66V10 component is a two-chip plastic ball grid array (PBGA) package measuring 4.22 mm x 3.93 mm x 0.66 mm thick with a 7 x 7 array of 49 solder balls.