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TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics Report
Automotive LiDAR Market Update: Chinese Vendors Take Early Lead
By 2025 TechInsights predicts that Hesai will maintain its market lead with 28% of the global automotive LiDAR market share, followed by RoboSense at 20%.
Analysis: Mobile Computing Vendor Market Share Q2 2023 Results
The mobile computing market was down 17% year-over-year in Q2 2023 in both shipments and revenue. While the notebook market showed signs of stabilization with sequential growth between the first and second quarter, the tablet market continued to see declines.
Smart Speaker and Smart Display Shipment and Installed Base Forecast for 88 Countries : 2014 to 2028
Global demand for smart speakers and smart displays is stalling and shipments are expected to decline by 7% in 2023 following a 2% drop in 2022.
Chip Observer (October 2023)
In TechInsights' Chip Observer, a publication dedicated to monitoring the semiconductor market from production facilities to consumer endpoints, the focus of this article is sustainability.
MicroBT KF1978E ASIC Miner Samsung SF3E GAA Process Advanced CMOS Essentials
The MicroBT WhatsMiner M56S++ cryptocurrency miner die features the first high-volume manufactured gate-all-around (GAA) CMOS technology, produced using Samsung's SF3E process, Samsung’s early version of their 3 nm process.
VR Headset Forecast by Price Tier 2014-2028 3Q 2023 Publication
TechInsights expects the VR headset market to be worth just under $8 billion and grow to an installed base of 37 million units by 2028.
VR Headset Forecast by Device Type 2014-2028 3Q 2023 Publication
TechInsights expects the VR headset market to be worth just under $8B and grow to an installed base of 37 million units by 2028.
Deep Dive Teardown of the Luminar Technologies Iris LiDAR 70-0034-00102203A15650 Automotive
The Luminar Iris seems to have different versions. The latest one is equipped with the flagship EX90 electric car from Volvo as the main sensor supporting autonomous driving system.
Intel Innovation 2023: It’s grand strategy revealed
The Chip Insider®
Sony IMX695AFR, Advanced Photo System Type-C (APS-C) Format, 26.1 MP Resolution, 3.77 μm Pixel Pitch, Stacked Back-Illuminated CMOS Image Sensor Device Essentials Folder
This report presents a device essentials folder (DEF) of Sony IMX695AFR Advanced Photo System Type-C (APS-C) Format, 26.1 MP Resolution, 3.77 µm Pixel Pitch, Stacked Back-Illuminated CMOS Image Sensor, extracted from Fujifilm X-H2S mirrorless camera.
Automotive Cockpit Domain Controllers: 2023 Market Update
Cockpit domain controllers (CDCs) represent one of the first types of systems with features that were previously in separate electronic control units, which support more than just infotainment, for example safety-critical functions, such as the instrument cluster, occupant monitoring, driver monitoring, and other ADAS features.
Analysis: Connectivity Technologies Forecast to 2028
The modern smartphone incorporates dozens of different wireless and wired technologies for charging, connections, and communication.
Global Smartphone Sales Forecast by Wireless Connectivity Technologies to 2028
The modern smartphone incorporates dozens of different wireless technologies for charging, connections, and communication. From UWB to Bluetooth to WiFi the modern smartphone is a complex powerhouse of wired and wireless technologies.
Global Smartphone Sales Forecast by Wired Connectivity Technologies to 2028
The modern smartphone incorporates dozens of different wired technologies for charging, connections and communication. From USB-C to Display Port to 3.5mm plug, the modern smartphone is a complex powerhouse of wired technologies.
Deep Dive Teardown of the Google Pixel Fold G9FPL Smartphone
The Google Pixel Fold features a relatively unorthodox design with two separate pieces serving as endcaps of the hinge cover. The more typical design, such as that in the Samsung Galaxy Z Fold4, Huawei Mate X3, or other foldables, is where the mechanical elements are present along most of the length of the hinge.
Deep Dive Teardown of the SuperMicro GPU SuperServer SYS-741GE-TNRT GPU Server
The Supermicro server contains two Intel Xeon Sapphire Rapids processors. It has a mechanical structure typical of professional servers in this class.
Deep Dive Teardown of the Honor X50 ALI-AN00 Smartphone
The Honor X50 was supplied for the first time by Qualcomm octa-core Snapdragon 6 Gen 1 processor SM6450-500-AB with package size 12.54 × 12.04 mm while the die size was 8.05 × 6.65 mm.
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