Insight: Why AI is rapidly rewriting the PSU BoM?

Report analyzes power shelf evolution toward three‑phase and high‑voltage designs, highlighting impacts on PSU topology, semiconductor content, and the resulting bill of materials.

This report highlights the rapid escalation of power shelves, their shift from single-phase to three-phase designs, and the emergence of high‑voltage (400 V to 800 V) solutions. The analysis dives into the impact on PSU topology, semiconductor content, and the resulting bill of materials, where GaN and SiC serve as decisive enablers while becoming potential bottlenecks. It provides an overview of how AI workloads are reshaping supply-chain dynamics and cost across datacenter PSUs.