HiSilicon Kirin 9030 Pro (Huawei Mate 80 Series) Advanced Packaging

 

  2 Min Read     March 24, 2026

 
 

Advanced Packaging Essentials on HiSilicon Kirin 9030 Pro: a 9-core, 14-thread application processor packaged using package-on-package with iPoP technology.

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This Advanced Packaging Essentials (APE) report provides deep insight into the advanced packaging innovations used in the manufacturing of the HiSilicon Technologies Kirin 9030 Pro processor, extracted from the Huawei Mate 80 Pro Max smartphone. The HiSilicon Kirin 9030 Pro is a 9-core, 14-thread application processor fabricated on SMIC's N+3 process node. The device is fully manufactured in China, packaged using package-on-package with organic interposer (iPoP) technology and includes serveral innovations TechInsights beleives are designed to help thermal performance of the processor.

This summary outlines the analysis* found on the TechInsights' Platform.

*Some analyses may only be available with a paid subscription.

 

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