Foundry
Elevate your foundry's performance with cutting-edge insights and strategic analysis.
Discover how our industry-leading expertise can revolutionize your chip design process and propel you ahead of the competition. Explore our comprehensive foundry solutions today.
Your Foundry Semiconductor Source
Through TechInsights, you can subscribe to foundry semiconductor products and multiple add-ons all in one place.
Sensors
Deep technical analysis to better understand image sensors and image processing as a key point of differentiation for serving customers.
IoT Connectivity SoC
Unparalleled technical and cost analysis for IoT SoCs which are essential to the Smart Home.
Compute
Leverage TechInsights to continue driving innovation and differentiation through superior SoC design.
Storage
Ensure cost-effective strategies in a competitive, commodity-driven market landscape.
Mobile RF
Refine your product roadmap, align with industry trends, and outpace competitors, ensuring your success in the challenging 5G Mobile RF landscape.
Power Semiconductors
Deep technical analysis on the latest innovations in energy-efficiency, power management, and low-power solutions to help you stay competitive and align your strategy.
Smartphones, Tablets, and Wearables
Insights into emerging trends and enabling technologies critical to the future.
Executive Insights
Timely, rapid insights on the megatrends shaping the semiconductor value chain.
Using TechInsights to Optimize Semiconductor Selection and Costs
Discover how a leading automotive manufacturer optimized semiconductor selection and reduced costs using TechInsights' comprehensive BOM data, advanced cost models, and engineering analysis tools.
Add-on Products
Add-on semiconductor products provide supplementary features and functionalities, enhancing the capabilities of the core TechInsights product or service.
Semiconductor Manufacturing Economics
Supply relationship and activity databases for semiconductor growth areas and detailed volume forecasts for chips in automotive and consumer electronics markets.
BOM Database and BOM Database with Subsystems
TechInsights' BOM costing and design wins database contains three decades of accumulated semiconductor data from our Teardown analysis of consumer electronics products.
Component Price Landscape (CPL)
Leading index for tracking 140+ commodity EE component categories and 50,000+ MPNs, aiding purchasing decisions.
Component Price Analyzer (CPA)
The CPA tool examines the Bill of Materials (BOMs) for individual customers in the field of electrical engineering. CPA compares the prices of components provided by the customers with the average market prices based on their purchase volume.
Handset Cost Model
The Handset Cost Model is a budgeting tool that estimates unit costs based on features like development stage, launch targets, volume, ASP, 4G/5G, displays, cameras, and SoC chipsets, allowing users to optimize specifications to meet business goals.s
High Performance Computing
The High Performance Computing product delivers reverse engineering analyses of advanced packaging, SoC designs, chiplets, and high-bandwidth memories (HBM) for data centers and enterprise servers.
EcoInsights
EcoInsights is a comprehensive solution designed to help semiconductor foundries drive significant environmental progress. From helping foundries understand where emissions originate, including renewable energy, to calculating emissions for offsite packaging, EcoInsights has the tools foundries need for their sustainability efforts.
Over 3,200 Reports
Published in the last 12 months
Over 100,000 Chipsets
Reverse engineered to date
TechInsights Appoints Dan Kim as Chief Strategy Officer
TechInsights has announced the appointment of Dan Kim as its new chief strategy officer, effective April 21, 2025. In this new role, Kim will lead TechInsights’ strategy and engagement with corporate and government customers across the Americas, Europe, and Asia.
Unlock the Future of Advanced Packaging: A Deep Dive into Hybrid Bonding
Discover how hybrid bonding is revolutionizing semiconductor packaging and driving the future of high-performance, low-power devices.
TechInsights’ NVIDIA HGX B200 Analysis Reveals HBM3E Supplier and Advanced Packaging Innovation
Explore TechInsights’ early analysis of NVIDIA’s HGX B200 AI accelerator, revealing SK hynix as the HBM3E supplier and showcasing the first commercial use of TSMC’s CoWoS-L packaging.
The authoritative information platform to the semiconductor industry.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
