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テックインサイツの解析は未知の情報を数値化するため、情報に基づく意思決定が行えます。テックインサイツは、先進的なメモリーを市場に投入する際のコストの試算、リスクとなりうる要素を判断するための市場の潜在的な問題の調査、リスク回避戦略の策定などのサポートを行います。
大規模な投資を行う際に、情報に基づく意思決定のために必要な「事実」を提示
最高クラスの製品の市場への迅速な投入
市場シェアと収益の拡大につながる確信
SSD ティアダウン
内容:
- 解析の範囲
- ティアダウンイメージ (画像)
- 主要な IC デザインウィンの表
- 概算部品コスト
- ティアダウンレポート: 年間 25 本
モバイルデバイスティアダウン
内容:
- Analysis Coverage
- Deep Dive ティアダウンレポート: 年間 60 本
- Quick Survey ティアダウンレポート: 年間 130 本
- Survey Plus ティアダウンレポート (高画質): 年間 75 本
- トレンド解析 – モバイルデバイスの概要レポート: 年間 4 本
- 解析チームによるオンサイト訪問: 年間 1 回
DRAM 機能解析
内容:
- 解析の範囲
- 最先端 DRAM に着目
- パッケージ画像、X 線画像
- CircuitVision (回路) 解析による最上層部メタルの光学顕微鏡画像と複数のダイ画像
- SEM 画像、テクノロジーノードの評価
- MFR レポート: 年間 13～15 本
DRAM: センストランジスタ/SWD トランジスタの特性
内容:
- 解析の範囲
- IOFF vs. ION、 IOFF vs. ID/LIN の普遍曲線、および各普遍曲線のデータポイントの伝達特性/出力特性
- トランジスタ特性レポート: 年間 4 本
- トレンド解析 – 定期更新の概要レポート
- 解析チームによるオンサイト訪問: アップグレード
NAND 機能解析
内容:
- 解析の範囲
- 最先端の平面型 NAND と 3D NAND に着目
- パッケージ画像、X 線画像
- CircuitVision (回路) 解析による最上層部メタルの光学顕微鏡画像と複数のダイ画像
- SEM 断面画像、テクノロジーノードの評価
- MFR レポート: 年間 13～15 本
先進的なプロセス/パッケージング
内容:
- 解析の範囲
- パッケージ画像、X 線画像
- 最上層部メタルの光学顕微鏡画像、複数のダイ画像
- SEM 断面画像、先端面取り形状の画像
- TEM-EDS による TEM 断面画像
- メモリー AME レポート: 年間 7～8 本
- パッケージ AME レポート: 年間 4～5 本
- トレンド解析 – 概要レポート: 年間 3 本
- 解析チームによるオンサイト訪問: 年間 1 回
プロセスフロー
プロセス/先進的なパッケージング サブスクリプションのご契約が必要になります。
内容:
- 解析の範囲
- プロセスフロー解析 (PFA) – プロセスの手順、装置の種類、材料 – レポート: 年間 8～9 本
- プロセスフロー フル エミュレーション (PFF) – 3D エミュレーション、レイアウトの GDS – レポート: 年間 5～6 本
- 解析チームによるオンサイト訪問、プロセスフローのトレンド解析が充実
回路解析
DRAM、NAND、エマージングメモリー
*レポートは個別に購入いただけます。
回路解析は現在まで年間サブスクリプションに含まれていませんが、カスタム解析としてご利用いただけます。
実際の作業対象範囲は案件ごとに異なりますので、プロジェクトの構想をテックインサイツの担当者にご相談ください。
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IP Corporate Strategy Summit
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ESSDERC/ESSCIRC 2019
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