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テックインサイツの解析は未知の情報を数値化するため、情報に基づく意思決定が行えます。テックインサイツは、先進的なメモリーを市場に投入する際のコストの試算、リスクとなりうる要素を判断するための市場の潜在的な問題の調査、リスク回避戦略の策定などのサポートを行います。
大規模な投資を行う際に、情報に基づく意思決定のために必要な「事実」を提示
最高クラスの製品の市場への迅速な投入
市場シェアと収益の拡大につながる確信
SSD ティアダウン
内容:
- 解析の範囲
- ティアダウンイメージ (画像)
- 主要な IC デザインウィンの表
- 概算部品コスト
- ティアダウンレポート: 年間 25 本
モバイルデバイスティアダウン
内容:
- Analysis Coverage
- Deep Dive ティアダウンレポート: 年間 60 本
- Quick Survey ティアダウンレポート: 年間 130 本
- Survey Plus ティアダウンレポート (高画質): 年間 75 本
- トレンド解析 – モバイルデバイスの概要レポート: 年間 4 本
- 解析チームによるオンサイト訪問: 年間 1 回
DRAM 機能解析
内容:
- 解析の範囲
- 最先端 DRAM に着目
- パッケージ画像、X 線画像
- CircuitVision (回路) 解析による最上層部メタルの光学顕微鏡画像と複数のダイ画像
- SEM 画像、テクノロジーノードの評価
- MFR レポート: 年間 13～15 本
DRAM: センストランジスタ/SWD トランジスタの特性
内容:
- 解析の範囲
- IOFF vs. ION、 IOFF vs. ID/LIN の普遍曲線、および各普遍曲線のデータポイントの伝達特性/出力特性
- トランジスタ特性レポート: 年間 4 本
- トレンド解析 – 定期更新の概要レポート
- 解析チームによるオンサイト訪問: アップグレード
NAND 機能解析
内容:
- 解析の範囲
- 最先端の平面型 NAND と 3D NAND に着目
- パッケージ画像、X 線画像
- CircuitVision (回路) 解析による最上層部メタルの光学顕微鏡画像と複数のダイ画像
- SEM 断面画像、テクノロジーノードの評価
- MFR レポート: 年間 13～15 本
先進的なプロセス/パッケージング
内容:
- 解析の範囲
- パッケージ画像、X 線画像
- 最上層部メタルの光学顕微鏡画像、複数のダイ画像
- SEM 断面画像、先端面取り形状の画像
- TEM-EDS による TEM 断面画像
- メモリー AME レポート: 年間 7～8 本
- パッケージ AME レポート: 年間 4～5 本
- トレンド解析 – 概要レポート: 年間 3 本
- 解析チームによるオンサイト訪問: 年間 1 回
プロセスフロー
プロセス/先進的なパッケージング サブスクリプションのご契約が必要になります。
内容:
- 解析の範囲
- プロセスフロー解析 (PFA) – プロセスの手順、装置の種類、材料 – レポート: 年間 8～9 本
- プロセスフロー フル エミュレーション (PFF) – 3D エミュレーション、レイアウトの GDS – レポート: 年間 5～6 本
- 解析チームによるオンサイト訪問、プロセスフローのトレンド解析が充実
回路解析
DRAM、NAND、エマージングメモリー
*レポートは個別に購入いただけます。
回路解析は現在まで年間サブスクリプションに含まれていませんが、カスタム解析としてご利用いただけます。
実際の作業対象範囲は案件ごとに異なりますので、プロジェクトの構想をテックインサイツの担当者にご相談ください。
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最新ニュースおよびブログ
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Peloton IPO Preview: All Hype, No Muscle
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A high-end mobile phone sells almost three times what it costs to manufacture it
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Deca Technologies Fan-In WLP in Qualcomm PM8150
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GaN, SiC, and Si technologies in AC Adapters
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Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown
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Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
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Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
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Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive22Jul
Part 2: Pixel Scaling and Scaling Enablers
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AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.16Jul
Part 1: Chip-stacking and chip-to-chip interconnect
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Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 201910Jun
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was05Jun
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges31May
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees11Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Samsung Galaxy S10 5G Teardown
Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world09Apr
Analyzing innovations in mobile radio frequency front-end integration
Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support09Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Samsung Galaxy S10+ Teardown
Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in01Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Lenovo Brings the New Snapdragon to Market
Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell20Feb
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to07Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
Job Vacancy: VP, Financial Controller
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate11Sep
Job Vacancy: Software Developer
We are currently seeking a Full Stack Software Developer to join one of our Colorado TechInsights Platform development teams. Do you have a passion for solving complex and interesting problems? Do you strive to learn something new every day? Do you11Sep
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The Inside Sales Representative is a key member of the go-to-market sales team. Working in close cooperation with the outside sales and Marketing teams, you will be responsible for following up on leads while identifying new business or sales10Sep
Job Vacancy: VP, Sales Operations
Thanks to our growth, we are now recruiting an individual to lead our Sales Operations functions and further evolve the business via the support of our corporate goals and objectives, including, but not limited to: reporting, analysis, business09Sep