Latest Blogs and Commentary
TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics Report
TechInsights' Critical Sub-System Driving Forces
TechInsights' Critical Sub-System Driving Forces
Still hot and green but clouds loom...
Still hot and green but clouds loom...
Chip Vendors Help Power Up 6GHz
Broadcom and Qualcomm will support a new automated-frequency-coordination (AFC) system to allow Wi-Fi and unlicensed 5G devices to use higher power in the 6GHz band, increasing performance and range.
Intel GNA Engine Adds Vision
The Gaussian and Neural Accelerator supports always-on audio and vision workloads, reducing power and adding security. It appears on Intel PC processors, other chips, and the Clover Falls add-on chip.
AMD Ships 3D V-Cache Processors
The Ryzen 7 5800X3D PC processor and Milan X server processor use TSMC’s chip-on-wafer (CoW) technology to stack more cache on the compute die, improving game and HPC performance.
TechInsights' Semiconductor Equipment Report
TechInsights' Semiconductor Equipment Report
TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics Report
It's hot but distant clouds threaten the upturn
It's hot but distant clouds threaten the upturn
AMD Adds DPUs With Pensando Buy
By acquiring Pensando, AMD will instantly offer DPUs alongside its CPUs and GPUs. Although it principally sells smart NICs, the startup recently announced a design win for its 7nm second-generation chip.
GF Fotonix Unites CMOS, Photonics
The new GlobalFoundries process combines photonic and digital components on a single 45nm chip. The primary application is data-center communications, but lidar and computing will benefit as well.
Fewer Find 3nm Worth the Wait
TSMC and Samsung have suffered lengthy delays in their 3nm processes, and the gain in density and other characteristics is smaller than in previous nodes. Intel says its future nodes are on schedule.
The EPC 2152 – A Fully Integrated GaN Half-Bridge IC
TechInsights comments on what the main reasons for this integration are, other innovations throughout the GaN die, and how there is not a ‘one size fits all’ approach in regard to power semiconductor devices.
SemiWEEK: SEMI ISS Takeaways Continued; Supply-chain clouds are still hanging over the industry; Stocks were mixed
Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.
Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead
Dick James, a Senior Fellow and Technology Analyst with TechInsights, entered the semiconductor industry in 1970, working for Philips Semiconductor. In this blog, he presents a retrospective of gate technology, ranging from 1971’s 10-micron design rules (!) through to the more modern 5-nanometer.
TetraMem Touts In-Memory DLA
The Silicon Valley startup uses a new type of memristor to perform analog math for deep-learning acceleration. It provides nonvolatile storage and performs low-power AI computations.
Sakura Debuts for Edge AI
EdgeCortix launched its first edge-AI inference chip by hardening its DNA IP, delivering low latency and high power efficiency for applications that fit into 5W to 20W.
Synopsys NPX6 Expands AI Options
The new deep-learning accelerator (DLA) can scale to more than 2,000 TOPS, providing a licensable core for applications such as autonomous driving and natural-language processing.